This past year, MediaTek declared that it had been temporarily giving up on the high-end smartphone chipset market. A lack of attention from customers and the relatively lower performance of these chips was a factor in that decision.

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The company has since focused its energies on the mid century and lower-end of the current market, resulting in chips such as the forthcoming Helio P40 and P70.

The P40 and P70 are relatively high-end chips, taking on the likes of Qualcomm’s 600 and 800 series processors. Details of a different chip known as the Helio P38 have also leaked out now, and based on a Chinese news website, is expected to compete from the Snapdragon 630 lineup of high-end chips from Qualcomm.

The P38, P40 and P70 appear to be using largely the exact same architecture. Judging from the escapes, all of them feature an 8-core CPU that uses 4x ARM Cortex A73 cores and 4x ARM Cortex A53 cores at varying clock-speeds. Do note that flagship chipsets like the Exynos chips powering Samsung’s Galaxy S8 and the Qualcomm ones in the Pixel 2 use the very same cores. Additionally, the new P series Helio chips are reportedly constructed on a 12 nm, which is fractionally less power efficient than the 10 nm procedure that Qualcomm and Samsung are quickly shifting to.

In MediaTek’s instance, these cores are running at much lower rates than in their flagships. The SD845 sees the processors hitting 2.45 GHz, in the case of this P38, the CPU is clocked to 1.8 GHz, which is about 30 percent slower. The P40 and P70 are clocked at 2.0 GHz and 2.5 GHz respectively. The graphics unit can be underclocked slightly.

Based on GizmoChina, it’s anticipated that the decrease clock-speed will provide the P38 an edge in tasks like gaming as it will run cooler and thus, have the ability to keep up its performance for longer.

Given the stiff competition from the likes of Huawei, Samsung and Qualcomm, MediaTek surely will not have it easy. Expect to see all of these chips, and perhaps even phones toting these chips, at MWC this season.


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